Wide Temperature Boards – GENE-SKU6

Wide Temperature Boards – GENE-SKU6

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Products: Wide Temperature Boards – GENE-SKU6

Compactly designed for low-power, high-efficiency consumption in confined environments, the GENE-SKU6 boasts a unique layout with the CPU(i7-6600U) located on the solder side of the board, which is consolidated by a heat spreader that facilitates quiet, fanless heat dissipation and vertical space reduction. The GENE-SKU6 offers multiple expansion platforms, such as MiniCards, mSATA and AAEON’s unique BIO interface, which provides for speedy, dynamic customization and fast turnaround time, making it ideally suited for most industrial or embedded computing applications. PoE (Power over Ethernet) support is also available for optional expansion. This feature provides connection to devices, such as wireless access points or an IP camera, and minimizes the fuss of traditional deployments with long power lines or limitations caused by a shortage of power outlets.

The GENE-SKU6 offers a highly flexible and dynamic BIO (board-to-board I/O) which can connect a Daughter Board for additional I/O port expansion, allowing users to implement their desired features without investing inordinate amounts of time and money in R&D. As an Intel® Core™ i solution, it can be used in consolidating surveillance systems, data analysis and other forms of smart industrial factory controls, and is ideally suited for smaller spaces, as it stands at 3.5 inches, the same size as a hard disk drive, which will really drive down manufacturing and other production costs.

  • Intel® Core™ i7/i5/i3/Celeron® Processor SoC
  • DDR4 1866/2133, SODIMM x 1
  • DVI, DP, 18/24-bit Dual-Channel LVDS
  • 2 CH Audio
  • SATA 6.0 Gb/s x 1 & mSATA (Shared with Half-size Mini-Card and Selected by BIOS)
  • Supports 8-bit Digital I/O, USB 2.0 x 2 , USB 3.2 Gen 1 x 4
  • COM x 4 (RS-232 x 1, RS-232/422/485 x 3)
  • Mini-Card Slot x 1 (Full size), TPM, SIM
  • Wide DC Support 9~36V, +12V Only (Optional)
  • 4/5/8-wire Resistive Touch Screen Controller
  • BIO Connector for Daughter Board
  • Solder Design for System Assembly and Thermal

Specification: Wide Temperature Boards – GENE-SKU6

FORM FACTOR 3.5" SubCompact Board
MTBF (HOURS) 123,000
CPU FREQUENCY Up to 3.0GHz
CHIPSET 6th Generation Intel® Core™ i7-6600U/i5-6300U Processor SoC
MEMORY TYPE DDR4 1866/2133, SODIMM x1
MAX. MEMORY CAPACITY Up to 16 GB
BIOS UEFI
WAKE ON LAN Yes
CPU 6th Generation Intel® Core™ i7-6600U/i5-6300U Processor SoC
POWER REQUIREMENT +9~36V or +12V
POWER SUPPLY TYPE AT/ ATX
POWER CONSUMPTION (TYPICAL) Intel® i7-6600U, DDR4 2133MHz 16GB, 1.75A@ +12V
DIMENSION (L X W) 5.75" x 4" (146mm x 101.7mm)
OPERATING TEMPERATURE 32°F ~ 140°F (0°C ~ 60°C)
STORAGE TEMPERATURE -40°F ~ 176°F (-40°C ~ 81°C)
OPERATING HUMIDITY 0% ~ 90% relative humidity, non-condensing
WATCHDOG TIMER 255 Levels
PARALLEL PORT -
CERTIFICATION CE/FCC
VIDEO OUTPUT DVI-D, LVDS, DP (Default) DVI-I, LVDS (include VGA signal)
BACKLIGHT INVERTER SUPPLY Yes
ETHERNET Intel® i210/i211, 10/100/1000Base-TX, RJ-45 x 2
AUDIO High Definition Audio Interface
USB PORT USB 3.2 Gen 1 x 4 USB 2.0 x 2
SERIAL PORT RS-232 x 1, RS-232/422/485 x 3
HDD INTERFACE SATA 3.0 x 1 +5V SATA power connector x 1
VGA/LCD CONTROLLER 6th Generation Intel® Core™ Processor SoC
FDD INTERFACE -
SSD mSATA (Shared with Half-size Mini-Card and Selected by BIOS)
EXPANSION SLOT BIO x 1 mSATA x 1 (Half-size), Mini-Card x 1 (Full-size)
DIO 8-bit
SIM x 1
TPM TPM2.0
TOUCH x 1

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Wide Temperature Boards – GENE-SKU6
Wide Temperature Boards – GENE-SKU6

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